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SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America

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​ First Spec Hand-off project in North America marks SEMIFIVE’s largest single contract to date Next-generation data center AI chip to integrate LPDDR6, PCIe Gen5, and Big Die technologies Tape-out targeted for the first half… Read More »SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America