Wuhu, Anhui, China, April 28, 2026 — As the global automotive industry faces intensifying price competition and narrowing differentiation, iCAUR is advancing a new approach to growth—one that moves beyond specifications and pricing toward long-term… Read More »Breaking the Rules of Competition: iCAUR Builds a New Global Model for the Boxy SUV Era
Wuhu, Anhui, China, April 28, 2026 — For global automotive partners and media, a deep factory visit reveals more about a brand’s core than a product showcase. During the 2026 iCAUR International Business Summit, global… Read More »End-to-End Digital Traceable Production: The iCAUR Smart Factory Showcases a New Form of Modern Automotive Smart Manufacturing
Wuhu, Anhui, China, April 28, 2026 — Wind swept across the hills of Wuhu, China, where the scent of earth mixed with the roar of engines. A celebration of electric off-road driving officially kicked off… Read More »Global Media Test Drive: iCAUR i-AWD Redefines New Energy Off-Roading
Money raised will go to EcoFlow non-profit partners Footprint Project and Convoy of Hope SEATTLE, April 28, 2026 /PRNewswire/ — EcoFlow, a leading provider of eco-friendly energy solutions, with the support of 945 number of… Read More »EcoFlow and Customers Support U.S. Disaster Response as Part of Home Upgrade and Social Impact Campaign
LEAD TECH, a Certified Continuous Inkjet Printer and Laser Marking Machine Manufacturer Serving 3,000+ Global Clients, Exhibits Full CIJ, Laser, and Piezo Inkjet Coding Solutions at Interpack 2026, Booth 8BC86, Düsseldorf, May 7–13 ZHUHAI,… Read More »LEAD TECH to Debut Its Cloud-Integrated CIJ and Laser Coding Suite at Interpack 2026, Backed by 20+ Patents
Arm AGI CPU-based platforms increase performance-per-watt for modern workloads High-density liquid-cooled systems accelerate HPC and AI workloads Flexible infrastructure supports agentic AI across cloud and enterprise environments SAN JOSE, Calif., April 28, 2026 /PRNewswire/… Read More »Supermicro Expands Data Center Building Block Solutions® Flexibility with Arm-Based Platforms and OCP Systems for Next-Gen AI Infrastructure