Singapore, January 26, 2026 — Teddy Lounge is a private, invite-only dating app launching in Singapore in early 2026. Unlike conventional dating platforms, Teddy Lounge requires every member to qualify for at least one medal… Read More »Teddy Lounge: A Private Dating App Where Entry Is Earned, Not Swiped
Tempus Logix Auto Transport launches an AI-powered calculator that delivers instant, exact car shipping prices with no hidden fees. Los Angeles, CA, January 26, 2026 — Tempus Logix Auto Transport has announced the launch of… Read More »Tempus Logix Launches AI-Powered Calculator to End Hidden Fees and Price Fluctuation in Auto Transport.
AscentOptics begins mass delivery of 400G and 800G optical modules, supporting global CSPs and AI infrastructure with high-bandwidth connectivity. Shenzhen, China, January 26, 2026 — AscentOptics, a leading provider of optical transceiver solutions, today announced… Read More »AscentOptics Achieves Volume Delivery of 400G and 800G Optical Modules to Accelerate AI Infrastructure Development
NEW YORK, Jan. 26, 2026 /PRNewswire/ — Five Sigma, the AI claims technology company, today announced that Starr, a global investment and insurance organization, has selected Five Sigma’s AI-native Claims Management Platform and Clive, the Multi-Agent… Read More »Starr Modernizes P&C and Specialty Claims with Five Sigma’s AI Claims Platform and Clive™
YIWU, China, Jan. 26, 2026 /PRNewswire/ — A news report from Yiwu Media Convergence Center: Today marks the traditional Chinese Laba Festival, heralding the approach of the Lunar Chinese New Year. A promotional video… Read More »“Yiwu Right Away” Promotional Video Released, 2026 Spring Festival Gala Preparations in Yiwu Enter Final Stage
SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ — JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable integration of high-frequency materials… Read More »JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs