Technologies

Dr. Kaushik Rajashekara shares his experience in electric and hybrid propulsion systems stemming from his career at General Motors and Rolls-Royce SANTA CLARITA, Calif., Nov. 19, 2024 (GLOBE NEWSWIRE) — NewHydrogen, Inc. (OTCMKTS:NEWH), the developer… Read More »New Hydrogen CEO Steve Hill and University of Houston Expert Discuss Hydrogen Adoption and Current State of Hydrogen Vehicles

​ STOCKHOLM, Nov. 19, 2024 /PRNewswire/ — Syncron, the leading provider of aftermarket service lifecycle management (SLM) solutions, announced today that Claire Rychlewski has joined the Syncron executive leadership team as Chief Revenue Officer (CRO). Claire… Read More »Syncron Appoints Claire Rychlewski as Chief Revenue Officer to Accelerate Revenue Growth in Burgeoning Aftermarket Service Lifecycle Management Market

​ KUALA LUMPUR, Malaysia, Nov. 19, 2024 /PRNewswire/ — realme, the world’s fastest-growing smartphone brand, is thrilled to unveil the much-anticipated GT 7 Pro in Malaysia, under the theme ‘Explore the Unexplored’. As the first… Read More »Unveiling Malaysia’s Best Smartphone of 2024: The realme GT 7 Pro, First Snapdragon 8 Elite, Now Available for RM3,699

Innofactor Plc Managers’ Transactions, on November 19, 2024, at 9:30 Finnish time Innofactor Oyj – Managers’ Transactions ____________________________________________ Person subject to the notification requirementName: Onni Bidco OyPosition: Closely associated person(X) Legal person (1):Person Discharging Managerial… Read More »Innofactor Plc: Managers’ Transactions

Press contact:Florence Lievre Tel.: +33 1 47 54 50 71 Email: florence.lievre@capgemini.com AI and Gen AI are set to transform cybersecurity for most organizations While Gen AI heightens vulnerabilities, more than half of organizations also anticipate faster… Read More »AI and Gen AI are set to transform cybersecurity for most organizations

EPIC Advanced Packaging marks an expansion of Applied’s global innovation platformCompany convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) —… Read More »Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing