IntentKey Empowers Advertisers to Deliver Highly Targeted Campaigns with AI-Driven Insights into Consumer Behavior and Trends Across 40,000+ U.S. Zip Codes LITTLE ROCK, Ark., Jan. 08, 2025 (GLOBE NEWSWIRE) — Inuvo, Inc. (NYSE American: INUV),… Read More »Inuvo Introduces Zip Code-Based Audience Insights and Targeting
NEW YORK, Jan. 08, 2025 (GLOBE NEWSWIRE) — Intent IQ, a leading provider of identity resolution and marketing solutions, today announced its compliance with the General Data Protection Regulation (GDPR). This achievement underscores the company’s… Read More »Intent IQ Implements GDPR Compliance, Strengthening Commitment to Privacy and Security
From 8 January to 27 February 2025, Chinatown will come alive with vibrant lantern displays, festive fairs, street light-ups, and an exciting lineup of cultural performances and activities. The Chinese New Year 2025 theme, “Ushering… Read More »Chinatown Welcomes the Year of the Snake with a Vibrant Celebration of Culture and Togetherness
BEIJING, Jan. 8, 2025 /PRNewswire/ — New terms such as the “goods economy,” ice and snow tourism festival, small-town charm, “wellness tea” and healing classes are making headlines and becoming focal points for businesses… Read More »Global Times: By creating a variety of new shopping patterns during long holidays, retail market to get a boost: experts
NANPING, China, Jan. 8, 2025 /PRNewswire/ — Golden Heaven Group Holdings Ltd. (“Golden Heaven” or the “Company”) (Nasdaq: GDHG), an amusement park operator in China, today announced that Nanping Golden Heaven Amusement Park Management Co., Ltd.… Read More »Golden Heaven Group Holdings Ltd. Enters into RMB15 Million Agreement for Management Solutions
New Sensor ICs Deliver Higher Isolation in a 40% Smaller Footprint Compared to Existing Products, Delivering Exceptional Power Density MANCHESTER, N.H., Jan. 08, 2025 (GLOBE NEWSWIRE) — Allegro MicroSystems, Inc. (“Allegro”) (Nasdaq: ALGM), a global… Read More »Allegro MicroSystems Redefines Sensing with Launch of New Current Sensor ICs in Compact Packages