NEW YORK, March 14, 2024 (GLOBE NEWSWIRE) — ODDITY Tech Ltd. (“ODDITY”) today announced the pricing of a previously announced underwritten secondary public offering of 4,782,609 of ODDITY’s Class A ordinary shares (“Ordinary Shares”) by… Read More »ODDITY Announces Pricing of Secondary Offering of Class A Ordinary Shares
SYDNEY, March 15, 2024 /PRNewswire/ — Roborock, a global leader in ultra-intelligent home robotics engineered to simplify daily life, launches its latest robot vacuum and mop Qrevo MaxV in Australia and New Zealand. The Qrevo… Read More »Roborock Introduces Next Generation Qrevo MaxV Smart Robotic Vacuum Into Australia and New Zealand
Conference Call to be held Monday, March 18, 2024 at 4:30 p.m. Eastern Time SAN JUAN, Puerto Rico, March 14, 2024 (GLOBE NEWSWIRE) — Red Cat Holdings, Inc. (Nasdaq: RCAT) (“Red Cat” or the “Company”),… Read More »Red Cat Holdings to Report Fiscal Third Quarter 2024 Financial Results and Provide Corporate Update on Monday, March 18, 2024
SAN ANTONIO, March 14, 2024 (GLOBE NEWSWIRE) — Rackspace Technology® (NASDAQ: RXT) (“Rackspace” or the “Company”), a leading end-to-end hybrid, multicloud, and AI technology solutions company, through its indirect subsidiary Rackspace Finance, LLC (the “New… Read More »Rackspace Technology Announces Launch of Exchange Offer Relating to its 3.50% First-Priority Senior Secured Notes due 2028
ROCHESTER, N.Y., March 14, 2024 (GLOBE NEWSWIRE) — Eastman Kodak Company (NYSE: KODK) today reported financial results for the fourth quarter and full year 2023. Fourth-quarter 2023 highlights include: Consolidated revenues of $275 million, compared… Read More »Kodak Reports Fourth-Quarter and Full-Year 2023 Financial Results
SAN JOSE, Calif. , March 14, 2024 (GLOBE NEWSWIRE) — Infinera (Nasdaq: INFN) announced today ICE-D, a new line of high-speed intra-data center optics based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology.… Read More »Infinera Announces New Line of High-performance 1.6 Tb/s Optics to Reduce Power per Bit by up to 75% for AI-driven Intra-Data Center Connectivity Applications