Technologies

ERS electronic introduces “High Power Dissipation” Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test

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​ MUNICH, Nov. 14, 2023 /PRNewswire/ — ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest “High Power Dissipation” Thermal Chuck System. The technology enables… Read More »ERS electronic introduces “High Power Dissipation” Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test