TORONTO, Oct. 15, 2024 (GLOBE NEWSWIRE) — Topicus.com Inc. (TSXV:TOI) announced today it intends to release its third quarter results on October 31, 2024. The Company’s quarterly results will be disseminated via press release and… Read More »Topicus.com Inc. Announces Release Date for Third Quarter Results
SYDNEY, Oct. 16, 2024 /PRNewswire/ — Cardiex, a global health technology company specializing in cardiovascular diagnostics and devices, today announced it has been awarded the $525,000 grand prize in the US National Institutes of… Read More »Cardiex Awarded $525,000 Grand Prize in NIH RADx Tech for Maternal Health Challenge
Denver, Oct. 15, 2024 (GLOBE NEWSWIRE) — authID Inc. (Nasdaq: AUID), a leading provider of secure identity verification and authentication solutions, today announced that the Compensation Committee of the Company approved the grant of options as… Read More »authID Announces Inducement Grants Under Nasdaq Listing Rule 5635(c)(4)
QUEBEC CITY, Canada, Oct. 15, 2024 (GLOBE NEWSWIRE) — LeddarTech® Holdings Inc. (“LeddarTech” or the “Company”) (Nasdaq: LDTC), an automotive software company that provides patented disruptive AI-based low-level sensor fusion and perception software technology, LeddarVision, for… Read More »LeddarTech Announces Receipt of US$3.0 Million Following Disbursement of the Second Tranche of the Previously Announced Bridge Financing
Company Reports 52% Revenue Growth, Initiates $15 Million Share Buyback Program SHANGHAI, Oct. 16, 2024 /PRNewswire/ — Nisun International Enterprise Development Group Co., Ltd. (“Nisun International” or the “Company”) (Nasdaq: NISN), a technology and… Read More »Nisun International Reports Financial Results for the First Half of 2024
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus direct imaging platform and introducing the Serena direct imaging platform to support mainstream and advanced IC… Read More »KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging