SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E
The company plans to supply the highest-performing, highest-capacity 12-layer HBM3E to customers by the end of the year DRAM chips made 40% thinner to increase capacity by 50% at the same thickness as the… Read More »SK hynix Begins Volume Production of the World’s First 12-Layer HBM3E





