— Hailiang (SHE: 002203) presented its latest liquid cooling precision components at the 12th Shanghai International Data Center Industry Exhibition. The company’s exhibit attracted considerable attention, reflecting the growing need for efficient thermal management in data centers.
The exhibition offered a key platform for discussing new developments in artificial intelligence (AI), computing power, liquid cooling technologies, and energy solutions. As the data center industry rapidly evolves, driven by the demand for greener, higher-density heat dissipation, Hailiang’s integrated manufacturing capabilities—from raw materials to finished precision components—are proving essential for sustainable data center infrastructure.
Hailiang’s display included several products addressing thermal challenges in modern data centers and high-performance computing. One highlight was their Conductive Copper Busbars. Crafted from high-purity T2 purple copper, these busbars offer excellent electrical conductivity, low resistance, and strong current-carrying capacity. They are customizable and corrosion-resistant, designed to reduce power transmission losses and improve the safety and stability of power distribution systems, particularly for high-power applications.
Also featured were Heat Dissipation Copper Busbars, which use high-purity oxygen-free copper to combine electrical conduction with efficient heat removal. Their optimized design prevents localized hotspots in high heat flux density applications like IGBT modules, power battery packs, and high-end server power supplies, extending equipment lifespan. The company also presented Heat Pipe Blanks, fundamental heat pipe materials with specialized micro-structured inner walls that provide strong capillary action and thermal conductivity. These serve as core blanks for custom heat pipes and vapor chambers, supporting phase-change cooling systems in consumer electronics, 5G base stations, and industrial temperature control.
Hailiang’s Skived Fin Cold Plates, manufactured using an integrated skived fin process, are free from welds or splices. They form a single, solid metal structure for highly efficient cooling. With high fin density and thin fins, they increase convective heat exchange, meeting the precise cooling needs of computing servers, energy storage converters, and high-power lasers. Furthermore, Diamond Copper Composite Materials, developed through industrial sintering, achieve thermal conductivity exceeding 600W/(m·K)—a more than 50% improvement over pure copper. Offering ultra-high thermal conductivity, tunable thermal expansion, and low density, these composites show promise in computing servers, optical communication modules, and high-end power electronic devices.
Rounding out the showcase were High-Performance Water-Cooled Plates, which employ multi-layer manifold microchannel technology. These plates provide exceptional heat dissipation, engineered to cool chips with high heat loads and flux densities. Representing a leading technical capability, their efficiency can be further boosted by an additional 20% when integrated with diamond copper substrates.
During the event, the Hailiang team engaged with hundreds of professional visitors and prospective buyers from across China. Discussions focused on product specifications, application contexts, and business models. The company reported forging numerous new and strengthened cooperative relationships during the exhibition’s opening day.
As the liquid cooling infrastructure for computing power continues its rapid evolution, Hailiang remains committed to advancing low-carbon intelligent manufacturing and green transformation. The company aims to drive industry upgrades through technological innovation and champion sustainable development through environmentally conscious practices. By collaborating with partners throughout the industry value chain, Hailiang seeks to collectively explore the vast potential of liquid cooling precision manufacturing in the intelligent era, contributing to the industry’s high-quality growth.
About Hailiang:
Hailiang (SHE: 002203) is a global leader in the research, development, production, and sales of high-performance copper and copper alloy materials, as well as precision components. With a strong focus on innovation and sustainable development, Hailiang provides advanced material solutions for various industries, including new energy, data centers, and consumer electronics.
Contact Info:
Name: chencheng.cai
Email: Send Email
Organization: Hailiang
Website: https://www.hailiangstock.com
Release ID: 89194912
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